SCD® 4.0

Flat Die Technology

Faster Changeover and Less Resin Degradation

Presenting the industry-envied Streamlined Coextrusion Die (SCD®), designed to minimize messy molten resin resistance, purge times and maintenance. Maximize layer uniformity, changeover speeds and productivity, and safeguard your company from unwarranted risk with the reliability and integrity of SCD® technology.

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SCD® 4.0

- Flat Die Technology

Faster Changeover and Less Resin Degradation

Presenting the industry-envied Streamlined Coextrusion Die (SCD®), designed to minimize messy molten resin resistance, purge times and maintenance. Maximize layer uniformity, changeover speeds and productivity, and safeguard your company from unwarranted risk with the reliability and integrity of SCD® technology.

Temperature Isolation

Respect the Resin

Minimal Degradation

Better Quality Film

Less Die Cleaning

Less Purge Material

Faster Changeovers

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Streamlined Coextrusion Die (SCD® 4.0)

At the heart of every Brampton Engineering multi-layer blown film line is our ground-breaking SCD® 4.0 Die Technology. With a direct path from the extruders and streamlined melt channels, BE achieves the shortest melt residence time and lowest wetted surface area in the industry. Every SCD® module in a multi-layer die shares this outstanding advantage, unlike cylindrical die technology which increases melt volume and wetted surface geometrically with every additional layer.

No matter how many layers are needed, the stackable SCD® 4.0 modules maintain their optimized resin flow path.

 

SCD® 4.0 Technology

SCD® Air 
The standard style, as it provides the temperature  
flexibility to process a wide variety of resins. 
Temperature isolation of up to 30° C is assured by
the air gap between modules.

SCD® Isotherm 
Highest degree of thermal control (via internal   
circulation of temperature controlled oil) enabling 
up to 90°C temperature difference between 
adjacent layers. Typically used when processing 
PVdC, which degrades rapidly above 160°

 

 

 

SCD® Air Plus
Rigid thermal insulation material plus air gap
between modules to reduce radiant heat transfer.
Used to isolate nylon layers from adjacent layers
up to 50°C cooler

SCD® Air Plus
With channels on both sides of die plates, offers 
reduced die height, lowest wetted surface and   
quickest  purge or structure changeover time.
allows least temperature variation between layers (<15°C)

Temperature Isolation

Every resin has its ideal processing temperature, but if it spends too long at elevated temperatures, thermal degradation will discolor and damage it. SCD® 4.0 ensures optional film quality and minimal downtime for purging and die cleaning with a 2-pronged approach:

  • minimize average residence time and eliminate dead spots where resin can move very slowly, gradually bleeding black specks of degraded resin
  • Ensure each resin can be processed optimally by selecting the right SCD® 4.0 technology and profiling their temperatures according to the film structure

Minimal Degradation

Individual SCD® Air die modules not only have dedicated temperature control zones, they are also separated by an air gap to minimize heat transfer from adjacent modules, which enables operating temperature differentials of up to 30ºC. Even more thermal isolation is assured with SCD® Air Plus and SCD® Isotherm.

That means when producing film structures containing nylon (PA), only the nylon layers need to be heated to 250ºC. Other layers of heat-sensitive materials like EVOH and sealants can be operated at lower temperatures, reducing degradation. Both die and extruder temperatures for each resin layer can be fine-tuned to optimize
processability and film quality.

Less Die Cleaning

The unique design of BE SCD® 4.0 Die Technology makes it the easiest co-extrusion die on the market to clean with complete confidence, no matter how many layers it features

  • The smaller wetted surface area means less plastic to remove
  • The fully streamlined channels – with no hang-up points – mean no corners to clean carbon out of
  • All channels are easy to reach when the die is opened, with no blind channels filled with inaccessible plastic. You can see exactly how clean your die is, before starting production!

Faster Changeover

BE SCD® 4.0 Die Technology purges faster because it has less wetted surface area – which is critical for quick product changeovers and clean manufacturing

The more steel in your die that is in contact with melted plastic, the longer it will take to purge out all traces when you change over to a different resin for another multi-layer film structure. This is especially true for nylon, which is difficult to remove from the die.