BRAMPTON ENGINEERING JOINS PACK EXPO SEMINAR ON TRENDS IN PACKAGING TECHNOLOGY

The Pack Expo International conference, North America’s largest packaging and processing trade show, took place in Chicago in early November.

The Pack Expo International conference, North America’s largest packaging and processing trade show, took place in Chicago in early November.

Brampton Engineering’s VP of Sales and Marketing David Kerfoot attended the Expo, joining executives from companies such a DuPont, Mintel Group, and Kortec in a seminar on packaging technology trends.

Up for discussion was technology such as micro-foamed layers in cast coextruded films, water quenched coextruded film, high-pressure pasteurization and co-injecting molding.

Kerfoot discussed BE’s pioneering AquaFrost® water quenched technology, highlighting its remarkable clarity and puncture resistance qualities. Having installed 17 AquaFrost® systems worldwide, Kerfoot said BE’s focus on continuous quality improvement has fine-tuned the system so much so that change over times can now be done in as few as 15 minutes, establishing BE as the undisputed leader in water quenched technology.

Packaging technology’s role in broader global issues such as food waste and food insecurity was another topic. Global food waste is a massive issue, valued at close to $1 trillion annually, and packaging companies “have an opportunity to be viewed as superheroes”, according to Heidi Parsons’ article on FoodProductionDaily.com.

Packaging technology has the potential to combat food waste by extending shelf life, increasing food safety, and protecting the product. BE technology, with blown film innovations, is at the forefront of this and other exciting venues for packaging technology trends.

Brampton Engineering